3D Measurement System of Wire for Automatic Pull Test of Wire Bonding
نویسندگان
چکیده
منابع مشابه
The Quality Test of Wire Bonding
The reliability of the IC chip during performance of its function in any application is very much dependant on the quality of the wire bond interconnection. If the quality of the wire bond interconnection is poor and not consistent, it has a significant impact on the reliability and dependability of the device. The quality of a wire bond is determined by the strength of the interfaces between t...
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Purpose – This paper attempts to review recent advances in wire bonding using copper wire. Design/methodology/approach – Dozens of journal and conference articles published recently are reviewed. Findings – The problems/challenges such as wire open and short tail defects, poor bondability for stitch/wedge bonds, oxidation of Cu wire, strainhardening effects, and stiff wire on weak support struc...
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Wire bonding using copper or insulated wire leads to many advantages and new challenges. Research is intensively performed worldwide, leading to many new findings and solutions. This article reviews recent advances in wire bonding using copper wire or insulated wire for advanced microelectronics packaging. Journal articles, conference articles and patents published or issued recently are review...
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A novel lighting system was devised for 3D defect inspection in the wire bonding process. Gold wires of 20 microm in diameter were bonded to connect the integrated circuit (IC) chip with the substrate. Bonding wire defects can be classified as 2D type and 3D type. The 2D-type defects include missed, shifted, or shorted wires. These defects can be inspected from a 2D top-view image of the wire. ...
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The real-time monitoring of an industrial ball bonding process is reported using a new type of test chips with custom-made integrated sensors (microsensors). These sensors were fabricated using a commercial double-metal CMOS process [1]. Two types of integrated monitors are reported, a temperature [2] and an ultrasound shear force sensor [3]. The temperature sensor uses the thermoelectric prope...
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ژورنال
عنوان ژورنال: Journal of Institute of Control, Robotics and Systems
سال: 2015
ISSN: 1976-5622
DOI: 10.5302/j.icros.2015.15.0131